Course Syllabus
Week |
Date |
Topic |
Reading |
Resources |
HW |
1 |
8/29 |
Logistics; Course overview |
|
BSAC history |
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2 |
9/3 9/5 |
Microfabrication; Single-mask SOI process; Capacitive accelerometer |
Jaeger: Ch. 1 Jaeger: 2.1 – 2.4. |
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3 |
9/10 9/12 |
Differential capacitive accelerometer; Electrostatic Actuators; Surface micromachining; Three-mask process; |
Jaeger: 11.1, 11.4 |
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4 |
9/17 9/19 |
Foundry processes: SOIMUMPs; POLYMUMPs; SUMMiT-V; |
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5 |
9/24 9/26 |
Basic mechanical design; Stress and strain, beam bending, flexure, torsion, residual stress, stress gradients, buckling |
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6 |
10/1 10/3 |
Gyroscopes; Sensing circuits; Electrical and mechanical noises; Noise equivalent input; |
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7 |
10/8 10/10 |
Transfer function; Damping, (squeeze-film) Self-sustaining oscillators; |
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8 |
10/15 10/17 |
Midterm on 10/15, in class Piezoresistivity, strain gauges; Wheatstone bridge; |
Sample Midterms:
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9 |
10/22 10/24 |
Optical MEMS; Digital Light Processing (DLP); LiDAR; 3D sensing; |
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10 |
10/29 10/31 |
Bulk micromachining; XeF2, KOH etching |
Jaeger Ch 11 |
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11 |
11/5 11/7 |
Semiconductors: Ion implantation; diffusion; thermal oxidation; diffused piezoresistor |
Jaeger Ch 6 |
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12 |
11/12 11/14 |
Fabrication: sputtering; plasma etching; RIE; DRIE; LPCVD; Evaporation; Lift-off; |
Jaeger |
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13 |
11/19 11/21 |
CMOS process cross section; CMOS MEMS; Epi-Seal process; MEMS-CMOS integration; |
Jaeger: 9.3 |
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14 |
11/26 11/28 |
Thanksgiving week; no class |
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15 |
12/3 12/5 |
TCR thermal conduction, black body radiation; Rayleigh-Ritz, Paschen, Field emission stability and pull-in, spring tuning |
247A project |
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16 |
12/10 12/12 |
RRR week 247 final project presentations. 147 students encouraged to attend. 247 Final projects due 11:59 pm Friday in bCourses |
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17 |
12/20 |
Official Final Exam |
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Course Summary:
Date | Details | Due |
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